• 提升錫球凹凸面的包覆性，降低研磨時應力問題
• 降低研磨後的薄晶圓破損或Dimple等問題
• 此產品可降低黏著劑殘留於錫球表面之問題發生
• New formulation to absorb bumps and reduce wafer stress
• Better bump absorption to achieve fewer dimples and less wafer damage
• Developed an adhesive with minimal residue to bump surfaces

此為撕離膠帶時能減少靜電產生的研磨用保護膠帶。

This is a back grinding tape which can decrease static during tape peeling.

• 透過膠帶張力控制及回報方式實現低張力貼合
• 使用多關節機械手臂進行三次元膠帶切割
• 實現WLCSP高精密性無氣泡的貼合作業
• Low-tension lamination by tape tension control unit and feedback control
• Three dimension cutting method by multi-jointed robot arm
• Accurate and void-less tape lamination to WLCSPs