先進封裝製程
Advanced Packaging Process
紫外線硬化型 適用於高溫製程之耐熱切割膠帶
UV Curable Heat-resistant Dicing Tape
可承受130~200°C高溫製程，經高溫加熱後仍可透過紫外線照射降低黏性，順利進行擴片與挑撿，適用於高溫封裝製程。
具備多重保護功能的錫球保護膠膜 (MP-BSF)Multiple Protect Bump Support Film (MP-BSF)
- 將具備多重保護功能的錫球保護膠膜貼於切半之晶圓上，可有5個面的保護功能
- 與LC膠帶貼合，則可有6個面的保護功能
- Five surface protection is possible by laminating MP-BSF to a half-cut wafer
- Six surface protection is possible by combining with LC tape
適用於扇出型晶圓級封裝之晶片置換技術 擴片製程 / 自組裝製程Die Placement Technologies for FO-WLP Expansion Process / Self-Assembly Process
琳得科提案的新製程結合膠帶擴片及自組裝技術，以實現精準的置換能力及優良的產出率。
To achieve both high placement accuracy and high throughput, LINTEC proposes a novel process that combines tape expansion technology and self-assembly technique.
錫球保護膠膜Bump Support Film
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錫球保護膠膜可應用於錫球晶圓，在半導體後段製程的不同步驟中帶來以下好處：
- 保護焊接處以提升錫球晶片的可靠度
- 減少刀片切割時造成的晶圓表面崩裂
- 改善薄型晶圓／易碎晶圓的搬運性
- 可用於包覆錫球／銅柱
- 可用於提升晶片強度 BSF can be applied to bump wafers for benefits in different steps throughout the semiconductor back end process.
- Can increase the reliability of bump chips by protecting the solder joint
- Decreases top side chipping caused during blade dicing
- Can be used to improve handling of thin/brittle wafers
- Can be used to embed bumps/Cu pillars
- Can be used to improve die strength
