先進封裝製程
Advanced Packaging Processes
具備多重保護功能的錫球保護膠膜 (MP-BSF)Multiple Protect Bump Support Film (MP-BSF)
- 將具備多重保護功能的錫球保護膠膜貼於切半之晶圓上，可有5個面的保護功能
- 與LC膠帶貼合，則可有6個面的保護功能
- Five surface protection is possible by laminating MP-BSF to a half-cut wafer
- Six surface protection is possible by combining with LC tape
適用於扇出型晶圓級封裝之晶片置換技術 擴片製程 / 自組裝製程Die Placement Technologies for FO-WLP Expansion Process / Self-Assembly Process
琳得科提案的新製程結合膠帶擴片及自組裝技術，以實現精準的置換能力及優良的產出率。
To achieve both high placement accuracy and high throughput, LINTEC proposes a novel process that combines tape expansion technology and self-assembly technique.
適用於高溫製程之耐熱膠帶Heat-resistant Tape
- 可依客戶需求，提供不同款式之耐熱膠帶
- 具優良穩定性，高溫製程後容易撕離、不留殘膠
- Provide different types of heat-resistant tapes according to customer needs
- Excellent stability, easy to peel off and no adhesive residue after high temperature process
錫球保護膠膜Bump Support Film
- 保護錫球避免因焊接造成破裂問題發生
- 適用於電漿製程，可從錫球上輕鬆撕離錫球保護膠膜
- 可對應研磨用保護膠帶及錫球保護膠膜
- 撕除研磨用保護膠帶後無殘膠
- Prevents solder joint crack by protecting bumps
- Easy removal of BSF on top of bumps with plasma process
- Serves both as back grinding tape and BSF
- No adhesive residue after peeling back grinding tape
300 mm全自動雙面膠帶貼合機 RAD-3601F/12300 mm Fully-Automatic Double-sided Tape Laminator RAD-3601F/12
- 高精度的貼合性能 (貼合精度: ±0.3 mm)
- 支撐鐵圈與貼合工作台的清潔功能 (選配)
- 載片ID讀取功能 (選配)
- 利用Nip Roller剝離方式，可有效地撕除離型膜
- Accurate lamination performance (accuracy : ±0.3 mm)
- Lamination support frame and attachment table cleaning function (option)
- Carrier ID reading function (option)
- The use of nip roller allows easy peel of release liner
