• 將具備多重保護功能的錫球保護膠膜貼於切半之晶圓上，可有5個面的保護功能
• 與LC膠帶貼合，則可有6個面的保護功能
• Five surface protection is possible by laminating MP-BSF to a half-cut wafer
• Six surface protection is possible by combining with LC tape

琳得科提案的新製程結合膠帶擴片及自組裝技術，以實現精準的置換能力及優良的產出率。

To achieve both high placement accuracy and high throughput, LINTEC proposes a novel process that combines tape expansion technology and self-assembly technique.

適用於各種高溫製程中，固定、保護及搬運工作片之膠帶
• 可依客戶需求，提供不同款式之紫外線硬化型耐熱膠帶
• 具優良穩定性，高溫製程後容易撕離、不留殘膠
Tape offers superior performance with regards to temporary fix, protection and handing during various high temperature processes.
• Provide different types of UV curable heat-resistant tapes according to customer needs
• Excellent stability, easy to peel off and no adhesive residue after high temperature process

錫球保護膠膜可應用於錫球晶圓，在半導體後段製程的不同步驟中帶來以下好處：
• 保護焊接處以提升錫球晶片的可靠度
• 減少刀片切割時造成的晶圓表面崩裂
• 改善薄型晶圓／易碎晶圓的搬運性
• 可用於包覆錫球／銅柱
• 可用於提升晶片強度
BSF can be applied to bump wafers for benefits in different steps throughout the semiconductor back end process.
• Can increase the reliability of bump chips by protecting the solder joint
• Decreases top side chipping caused during blade dicing
• Can be used to improve handling of thin/brittle wafers
• Can be used to embed bumps/Cu pillars
• Can be used to improve die strength