特殊應用材料
Special Application

極低微粒研磨用保護膠帶 Extremely Low Particle BG Tape

極低微粒研磨用保護膠帶專門用於混合鍵結製程。也可適用於傳統研磨製程、超薄晶圓研磨以及DBG™/SDBG製程。

Extremely low particle BG tape targeted for use in Hybrid Bonding processes.Tapes available for processes such as conventional BG process, ultra-thin wafer grinding and DBG™/SDBG.

應用PSQ的透明黏著劑系列Transparent adhesive series using PSQ BL7411/ BL5401

PSQ是矽氧樹脂和玻璃之間的化學結構,故具有高透明性。 另外PSQ還具有適當的硬度,作為黏著劑可發揮其優越的性能。

A special material with a structure between silicone and glass, highly transparent and highly adhesive.

  • BL7411為標準型黏著劑且BL5401為高導熱型黏著劑 。
  • 外觀:BL7411為無色透明,BL5401為白色。
  • BL7411 is a standard type and BL5401 is a high thermal conductive type.
  • Appearance:BL7411 is colorless and transparent, BL5401 is white.

適用於晶圓錫球的最新概念New concept for Bumped wafer
    概要
  • 改善晶圓錫球T.T.V(總厚度變化)的全新解決方案
  • 顯著減少非錫球邊緣區與錫球之間的厚度變化

  • Outline
  • ・New solution for T.T.V. improvement in bumped wafers.
  • ・Significantly reduces the thickness variation between the non-bumped edge area and bumped area
無應力撿晶膠帶Stress Free Pick Up Tape
    專為「無針式」與「超薄晶片」設計的新型撿晶膠帶 為避免晶片損傷,可透過變更擴片條件來控制撿晶性能,無需使用撿晶針頭。
  • 可支援撿取方形晶片最大至15mm。
  • 可在不影響傳統撿晶速度的方式取放厚度10μm的晶片。
  • 更換晶片尺寸時,無須調整針頭配置與高度。
  • A new pickup tape specialized for “Needle-less” & “Thinner dies.” To avoid die damage, control pickup performance using expand conditions without pickup needles.
  • Supported up to 15mm square dies for pickup.
  • Able to pick up thickness of 10μm dies without compromising conventional pickup speed.
  • No need to adjust the needle layout or height when changing die sizes.