極低微粒研磨用保護膠帶 Extremely Low Particle BG Tape
極低微粒研磨用保護膠帶專門用於混合鍵結製程。也可適用於傳統研磨製程、超薄晶圓研磨以及DBG™/SDBG製程。
Extremely low particle BG tape targeted for use in Hybrid Bonding processes.Tapes available for processes such as conventional BG process, ultra-thin wafer grinding and DBG™/SDBG.
PSQ是矽氧樹脂和玻璃之間的化學結構,故具有高透明性。 另外PSQ還具有適當的硬度,作為黏著劑可發揮其優越的性能。
A special material with a structure between silicone and glass, highly transparent and highly adhesive.