使用聚矽倍半氧烷 (PSQ) 作為主要有機化合物，具有高黏著性及優良光學性能的 最新黏晶材料。

Novel die bonding material using PSQ as main polymer which has high adhesion and good optical properties

因應5G世代來臨，電子裝置需處理大容量資訊，也因此有了控制熱能消散的需求，極薄熱電式致冷晶片將能解決此問題。

In 5G era, devices must process massive amounts of data, which has created a need for heat dissipation control. Thinner Peltier elements are therefore in demand

工廠及電子產品產生的廢熱不被使用即遭丟棄，如何有效地利用這些熱能是需要解決的議題。因此，琳得科開發適用於熱電轉換器之膠膜，期待能有效利用廢熱。

Waste heat given off in factories and by electronic products are being discarded without being used. There is great demand for ways to use this heat effectively. Thus, thermoelectric sheet has been developed by Lintec to recycle the wastes heat energy.