極低微粒研磨用保護膠帶 Extremely Low Particle BG Tape
極低微粒研磨用保護膠帶專門用於混合鍵合製程。也可適用於傳統研磨製程、超薄晶圓研磨以及DBG™/SDBG製程。
Extremely low particle BG tape targeted for use in Hybrid Bonding processes.Tapes available for processes such as conventional BG process, ultra-thin wafer grinding and DBG™/SDBG.
PSQ是矽氧樹脂和玻璃之間的化學結構，故具有高透明性。 另外PSQ還具有適當的硬度，作為黏著劑可發揮其優越的性能。
A special material with a structure between silicone and glass, highly transparent and highly adhesive.
- BL7411為標準型黏著劑且BL5401為高導熱型黏著劑 。
- 外觀：BL7411為無色透明，BL5401為白色。
- BL7411 is a standard type and BL5401 is a high thermal conductive type.
- Appearance：BL7411 is colorless and transparent, BL5401 is white.
專為「無針式」與「超薄晶片」設計的新型撿晶膠帶
為避免晶片損傷，可透過變更擴片條件來控制撿晶性能，無需使用撿晶頂針。
- 可支援撿取方形晶片最大至15mm。
- 可在不影響傳統撿晶速度的方式取放厚度10μm的晶片。
- 更換晶片尺寸時，無須調整頂針配置與高度。
A new pickup tape specialized for “Needle-less” & “Thinner dies.” To avoid die damage, control pickup performance using expand conditions without pickup needles.
- Supported up to 15mm square dies for pickup.
- Able to pick up thickness of 10μm dies without compromising conventional pickup speed.
- No need to adjust the needle layout or height when changing die sizes.
