- 具雷射穿透性,可穿透膠帶對晶圓背面進行雷射加工
- 擴分割時具優良的擴張性能
- 抗靜電性能
- The high transparent feature enables laser application to wafer backside through tape
- Expandability for die separation
- Antistatic feature
*「Stealth Dicing™」為濱松光子學株式會社的註冊商標
"Stealth Dicing™" is trademark of Hamamatsu Photonics K.K.