切割膠帶 / 黏晶切割膠帶
Dicing Tape / Dicing Die Bonding Tape
適用於雷射穿透打印製程之切割膠帶Dicing Tape for Laser Marking Through-tape Process
- 雷射印字可穿透切割膠帶印於晶圓表面
- 可穿透切割膠帶於晶圓表面執行紅外線檢查(切割後的晶片檢查)
- Capable of laser marking to Si wafer / backside coating layer through dicing tape
- Capable of performing IR inspection (chipping inspection after dicing) to Si wafer / backside coating layer through dicing tape
適用於穿透性「隱形切割™」製程之切割膠帶 Dicing Tape for Stealth Dicing™ Through-tape Process
- 具雷射穿透性，可穿透膠帶對晶圓背面進行雷射加工
- 擴片分割時具優良的擴張性能
- 抗靜電性能
- The high transparent feature enables laser application to wafer backside through tape
- Expandability for die separation
- Antistatic feature
*「Stealth Dicing™」「隱形切割™」為濱松光子學株式會社的商標。
"Stealth Dicing™" is trademark of Hamamatsu Photonics K.K.
適用於TSV、穿透性「隱形切割™」製程之切割膠帶Dicing Tape for TSV / Stealth Dicing™
- 可對應載片剝離後的溶劑洗滌製程
- 適用於穿透性隱形雷射切割
- 可對應擴片分割時具優良的擴張性能，非使用 PVC 基材
- Resistant to solvents applied after hard support removal
- High transparency to allow Stealth Dicing™ through tape
- Enables die separation by tape expansion after Stealth Dicing™. No use of PVC film
*「Stealth Dicing™」「隱形切割™」為濱松光子學株式會社的商標。
"Stealth Dicing™" is trademark of Hamamatsu Photonics K.K.
