晶片背面保護膠帶
Backside Coating Tape
晶片背面保護膠帶
(具有極佳打印清晰度的紅外線穿透型) Precut Backside Coating Tape
(IR Transmission Type with Excellent Marking Visibility)
(具有極佳打印清晰度的紅外線穿透型) Precut Backside Coating Tape
(IR Transmission Type with Excellent Marking Visibility)
開發中膠帶具備以下特性：
・在紅外線波段具備高透明度，提供優異的紅外線檢測性
・雷射打印之字元在經過回焊製程後，仍保持清晰易讀
The development tape offers the following features:
・High transparency in the IR region, providing excellent IR inspectability
・Laser-marked characters remain clearly legible after reflow
難燃型晶片背面保護膠帶Backside Coating Tape (Flame retardant)
具備阻燃性能的難燃型晶片背面保護膠帶之新開發品
- 可達UL94VTM-0之阻燃標準
- 適用於需要達到高可靠度及高安全性之產品 *與LC88系列(高可靠度)具備同等的可靠度
- Achieved flame retardant standard UL94VTM-0
- Targeted at products that require high levels of reliability and safety *Ensures equivalent reliability as LC88 series (high reliability type)
晶片背面保護膠帶（標準型、高可靠度型、紅外線穿透型）Backside Coating Tape (General Type, High Reliability, Infrared Transmission Type)
- 適用於保護及補強晶圓背面
- 有別於傳統液態塗佈劑，可提升保護層厚度的高精密度
- 優良的雷射打印性能
- 使用專用貼合機「RAD-3600F/12」，可達到高精密的貼合性能
- Effective in protecting and reinforcing the surface of wafer backside
- Higher thickness uniformity than the conventional liquid coating
- Excellent laser marking performance
- Highly efficient lamination achieved with the “RAD-3600F/12”, a laminator specially designed for LC Tape
適用於極薄晶圓之晶片背面保護膠帶 Backside Coating Tape (Precut Type)
- 適用於極薄晶圓，可抑制翹曲狀況發生
- 適用於保護及補強晶圓背面
- 有別於傳統液態塗佈劑，可提升保護層厚度的高精密度
- Easy lamination and prevents wafer warpage of thin wafer
- Reinforces the wafer
- Higher thickness uniformity than the conventional liquid coating
熱傳導型晶背保護膠帶 Backside Coating Tape (Thermal Conductive Type)
-
具高熱傳導性能之晶片背面保護膠帶。賦予晶片背面保護膠帶高熱傳導特性，使發熱的元件可從晶片背面將熱氣散發到外部。
- 實現3W/m·K的高熱傳導率
- 使用專用膠帶貼合機「RAD-3600F/12」實現良好的膠帶貼合度 The high thermal conductivity of this backside coating tape allows the heat generated by the device to be dispersed from the backside of the die.
- High thermal conductivity of 3W/m·K
- Highly efficient lamination achieved with the LC Tape laminator, “RAD-3600F/12”
多功能晶片背面保護膠帶Multifunction Backside Coating Tape
- 具可靠性及重複加工性等功能
* 擁有與LC28X4系列膠帶(高可靠性膠帶)同等級之可靠性
* 可於硬化前撕除及重覆黏貼膠帶 - 雷射打印可視性與一般 LC 膠帶等級相同
- Enables what has been considered a trade-off performance; high reliability and rework-ability
* Ensures equivalent reliability as LC28X4 series (high reliability type)
* In necessary cases, tape can be peeled off and re-laminated before heat curing - Equivalent visibility of laser marking compared to conventional products
300 mm全自動晶圓背面保護膠帶貼合機 RAD-3600F/12300 mm Fully-Automatic LC Tape Laminator RAD-3600F/12
- 透過獨自開發的貼合機構，實現高精度膠帶貼合
- 設備內採用Precut方式，避免切割刀接觸晶圓造成損傷
- 選配：Double Cassette
- 選配：晶圓ID Reader
- 選配：主機通訊功能 (通訊方式 : SECS-I、HSMS 基準、軟體 : GEM 基準)
- 選配：對應翹曲晶圓 (200 mm晶圓 : 5 mm / 300 mm晶圓 : 7 mm)
- Highly precise tape lamination is achieved with the uniquely developed laminating mechanism
- The in-line precut mechanism eliminates wafer edge damage caused by tape cutting along the wafer periphery
- Option : Double cassette loading
- Option : Wafer ID reader
- Option : Host communication function (communication format : conforms to SECS-I and HSMS/software : conforms to GEM)
- Option : Warped wafer capability (200 mm wafer : 5 mm / 300 mm wafer : 7 mm)
