• 可達UL94VTM-0之阻燃標準
• 適用於需要達到高可靠度及高安全性之產品
*與LC88系列(高可靠度)具備同等的可靠度

• Achieved flame retardant standard UL94VTM-0
• Targeted at products that require high levels of reliability and safety
*Ensures equivalent reliability as LC88 series (high reliability type)

• 適用於保護及補強晶圓背面
• 有別於傳統液態塗佈劑，可提升保護層厚度的高精密度
• 優良的雷射打印性能
• 使用專用貼合機「RAD-3600F/12」，可達到高精密的貼合性能
• Effective in protecting and reinforcing the surface of wafer backside
• Higher thickness uniformity than the conventional liquid coating
• Excellent laser marking performance
• Highly efficient lamination achieved with the “RAD-3600F/12”, a laminator specially designed for LC Tape

• 適用於極薄晶圓，可抑制翹曲狀況發生
• 適用於保護及補強晶圓背面
• 有別於傳統液態塗佈劑，可提升保護層厚度的高精密度
• Easy lamination and prevents wafer warpage of thin wafer
• Reinforces the wafer
• Higher thickness uniformity than the conventional liquid coating

此款晶片背面保護膠帶適用於 WLCSP，可進行隱形切割加工製程。 相較以往雷射刻槽後的刀片切割方法，大幅降低晶片裂痕問題，可實現隱形切割狹小切口的最大特色。

This tape is suitable for process using stealth dicing™ for WLCSP with backsidecoating tape. The strong advantage of stealth dicing™ is minimal kerf width and chipping less dicing; compared to laser grooving + blade dicing process.

• 具可靠性及重複加工性等功能
  * 擁有與LC28X4系列膠帶(高可靠性膠帶)同等級之可靠性
  * 可於硬化前撕除及重覆黏貼膠帶
• 雷射打印可視性與一般 LC 膠帶等級相同
• Enables what has been considered a trade-off performance; high reliability and rework-ability
  * Ensures equivalent reliability as LC28X4 series (high reliability type)
  * In necessary cases, tape can be peeled off and re-laminated before heat curing
• Equivalent visibility of laser marking compared to conventional products

• 透過獨自開發的貼合機構，實現高精度膠帶貼合
• 設備內採用Precut方式，避免切割刀接觸晶圓造成損傷
• 選配：Double Cassette
• 選配：晶圓ID Reader
• 選配：主機通訊功能 (通訊方式 : SECS-I、HSMS 基準、軟體 : GEM 基準)
• 選配：對應翹曲晶圓 (200 mm晶圓 : 5 mm / 300 mm晶圓 : 7 mm)
• Highly precise tape lamination is achieved with the uniquely developed laminating mechanism
• The in-line precut mechanism eliminates wafer edge damage caused by tape cutting along the wafer periphery
• Option : Double cassette loading
• Option : Wafer ID reader
• Option : Host communication function (communication format : conforms to SECS-I and HSMS/software : conforms to GEM)
• Option : Warped wafer capability (200 mm wafer : 5 mm / 300 mm wafer : 7 mm)