晶片背面保護膠帶
Backside Coating Tape
難燃型晶片背面保護膠帶Backside Coating Tape (Flame retardant)
具備阻燃性能的難燃型晶片背面保護膠帶之新開發品
- 可達UL94VTM-0之阻燃標準
- 適用於需要達到高可靠度及高安全性之產品 *與LC88系列(高可靠度)具備同等的可靠度
- Achieved flame retardant standard UL94VTM-0
- Targeted at products that require high levels of reliability and safety *Ensures equivalent reliability as LC88 series (high reliability type)
晶片背面保護膠帶（標準型、高可靠度型、紅外線穿透型）Backside Coating Tape (General Type, High Reliability, Infrared Transmission Type)
- 適用於保護及補強晶圓背面
- 有別於傳統液態塗佈劑，可提升保護層厚度的高精密度
- 優良的雷射打印性能
- 使用專用貼合機「RAD-3600F/12」，可達到高精密的貼合性能
- Effective in protecting and reinforcing the surface of wafer backside
- Higher thickness uniformity than the conventional liquid coating
- Excellent laser marking performance
- Highly efficient lamination achieved with the “RAD-3600F/12”, a laminator specially designed for LC Tape
適用於極薄晶圓之晶片背面保護膠帶 Backside Coating Tape (Precut Type)
- 適用於極薄晶圓，可抑制翹曲狀況發生
- 適用於保護及補強晶圓背面
- 有別於傳統液態塗佈劑，可提升保護層厚度的高精密度
- Easy lamination and prevents wafer warpage of thin wafer
- Reinforces the wafer
- Higher thickness uniformity than the conventional liquid coating
熱傳導型晶背保護膠帶 Backside Coating Tape (Thermal Conductive Type)
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具高熱傳導性能之晶片背面保護膠帶。賦予晶片背面保護膠帶高熱傳導特性，使發熱的元件可從晶片背面將熱氣散發到外部。
- 實現3W/m·K的高熱傳導率
- 使用專用膠帶貼合機「RAD-3600F/12」實現良好的膠帶貼合度 The high thermal conductivity of this backside coating tape allows the heat generated by the device to be dispersed from the backside of the die.
- High thermal conductivity of 3W/m·K
- Highly efficient lamination achieved with the LC Tape laminator, “RAD-3600F/12”
多功能晶片背面保護膠帶Multifunction Backside Coating Tape
- 具可靠性及重複加工性等功能
* 擁有與LC28X4系列膠帶(高可靠性膠帶)同等級之可靠性
* 可於硬化前撕除及重覆黏貼膠帶 - 雷射打印可視性與一般 LC 膠帶等級相同
- Enables what has been considered a trade-off performance; high reliability and rework-ability
* Ensures equivalent reliability as LC28X4 series (high reliability type)
* In necessary cases, tape can be peeled off and re-laminated before heat curing - Equivalent visibility of laser marking compared to conventional products
300 mm全自動晶圓背面保護膠帶貼合機 RAD-3600F/12300 mm Fully-Automatic LC Tape Laminator RAD-3600F/12
- 透過獨自開發的貼合機構，實現高精度膠帶貼合
- 設備內採用Precut方式，避免切割刀接觸晶圓造成損傷
- 選配：Double Cassette
- 選配：晶圓ID Reader
- 選配：主機通訊功能 (通訊方式 : SECS-I、HSMS 基準、軟體 : GEM 基準)
- 選配：對應翹曲晶圓 (200 mm晶圓 : 5 mm / 300 mm晶圓 : 7 mm)
- Highly precise tape lamination is achieved with the uniquely developed laminating mechanism
- The in-line precut mechanism eliminates wafer edge damage caused by tape cutting along the wafer periphery
- Option : Double cassette loading
- Option : Wafer ID reader
- Option : Host communication function (communication format : conforms to SECS-I and HSMS/software : conforms to GEM)
- Option : Warped wafer capability (200 mm wafer : 5 mm / 300 mm wafer : 7 mm)
