DBG / SDBG製程
DBG / SDBG Process
適用於DBG製程黏晶切割膠帶Dicing Die Bonding Tape for DBG Process
- 降低Kerf Shrink、Kerf Shift，黏著劑層可進行Full Cut Laser Dicing
- 不需膠帶擴片製程即可進行DAF擴片
- 具易撿晶功能，可有效達到高品質極薄晶片之製造生產
- Minimizes kerf shrinkage and kerf shift, which is essential for successful laser cut to singulate the DAF layer
- Eliminates tape expand process for DAF expansion
- Easy pick up for ultra-thin dies
適用於DBG及SDBG製程之研磨用保護膠帶Back Grinding Tape for DBG / SDBG Process
此款研磨用保護膠帶可用於DBG 及SDBG 製程，具備晶圓電路面的高包覆性及紫外線照射後的低黏著力，可實現薄型晶片的穩定加工需求。
This back grinding tape is designed for the DBG (Dicing Before Grinding) and SDBG (Stealth Dicing Before Grinding) process. By designing a material with high adhesion to the circuit side and low adhesion after UV irradiation, stable processing of thin dies is achieved.
